A new way to mount a power chip. The unique, patent-pending qAttach surface topology stops very thin solder layers from delaminating. It's cheap to manufacture, which makes it an effective route to ultra-high thermal performance.
How it works.
A patent-pending surface topology holds a very thin solder layer in place, so it doesn't delaminate.
Much thinner than today's attach layers, so the heat has far less to cross.
Works on standard equipment at close to zero pressure, so it fits lines that already exist.
Why it matters.
Heat is one of the three limits on switching speed. qAttach removes it.
From the chip itself to the heat exchanger it sits on. qAttach can be used as both a die-attach and a package-attach technology.
Works across the power semiconductors in use today. QPT licenses it to semiconductor and module manufacturers.
For engineers.
Measured thermal conductivity through the layer.
Layer thickness, against the 30–60 µm sintered-silver layers used today: 10–15× better heat transfer.